%0 Journal Article
%T ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM<br>Mo粉表面化学镀Cu及其反应机理
%A WANG Guangjun
%A WANG Dezhi
%A ZHOU Jie
%A WU Zhuangzhi
%A XU Bing
%A <br>王光君
%A 王德志
%A 周杰
%A 吴壮志
%A 徐兵
%J 金属学报
%D 2009
%I 
%X By using Sn–Pd catalyst system, the electroless plating Cu on the surface of Mo powder was performed to fabricate Cu/Mo composite powder. Composition, morphology and formation process of Cu/Mo particles were analyzed by XRD, SEM/EDS and XPS. The formation mechanism of Cu/Mo particles can be described as follows: the PdCl2 (activator) deposited on the surface of Mo particles firstly and then was reduced by SnCl2 (sensitizer) to nano Pd particles, which are the nucleation sites for Cu depositionfinally Cu coating formed.
%K electroless plating Cu
%K Mo powder
%K Cu/Mo coposite powder
%K reaction mechanism<br>化学镀Cu
%K Mo粉
%K Cu/Mo复合粉体
%K 反应机理
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=889D110DB03E97AF7D29F17B3AC1FE22&yid=DE12191FBD62783C&vid=94E7F66E6C42FA23&iid=E158A972A605785F&sid=EB58C3052341AAA3&eid=0493D643315CD829&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=12