%0 Journal Article
%T MOLECULAR DYNAMICS SIMULATION OF TENSILE STRESS INDUCED BY DEALLOYED LAYER IN Cu3Au<br>Cu3Au中脱合金层产生内应力的分子动力学模拟
%A LI Qikai
%A ZHANG Yue
%A GUO Xianzhong
%A CHU Wuyang
%A <br>李启楷
%A 张跃
%A 郭献忠
%A 褚武扬
%J 金属学报
%D 2003
%I 
%X During stress corrosion cracking of Cu3Au alloy, there is a dealloyed layer on the surface because of preferential dissolution of Cu, and there is a linear distribution of Cu vacancy concentration in the dealloyed layer. Molecular dynamics simulation has been done on the three-dimensional crystal (about 148,000 atoms) by employing the embedded-atom method (EAM) potential. Simulation shows that Cu3Au crystal in which there is a dealloyed layer on one surface and one end is fixed will be deflected after relaxing for a long time because of a tensile stress generated at or near the dealloyed layer interface. The deflection and then the tensile stress increases with increasing the depth of dealloyed layer and the vacancy concentration in the dealloyed layer.
%K dealloyed layer
%K induced stress
%K molecular dynamics simulation
%K Cu<br>脱合金疏松层
%K 内应力分布
%K 分子动力学模拟
%K Cu3Au
%K 应力腐蚀
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=2921AAE56042047D&yid=D43C4A19B2EE3C0A&vid=7C3A4C1EE6A45749&iid=CA4FD0336C81A37A&sid=987EDA49D8A7A635&eid=318E4CC20AED4940&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=17