%0 Journal Article
%T High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors<br>高速雪崩光探测器同轴封装的高频分析
%A XU Guang-hui
%A CHAI Guang-yue
%A PENG Jin-hua
%A HUANG Chang-tong
%A DUAN Zi-gang
%A TAN Ke-min
%A <br>徐光辉
%A 柴广跃
%A 彭金花
%A 黄长统
%A 段子刚
%A 谭科民
%J 光子学报
%D 2012
%I 
%X Based on the frequency response model,high frequency characteristic analysis for the TO packaged avalanche photodetectors is presented.The influence on frequency performance of TO packaging,including chip,bondwire,transimpedance amplifer,and TO header elements are investigated.By changing inductance parameters induced by different bandwires,the different frequency responses are observed.Finally,by considering the engineering conditions,a -3 dB bandwidth of 10GHz is optimally obtained for TO packaging.
%K Avalanche photodetector
%K TO can packaging
%K Frequency response
%K Transimpedance amplifer<br>雪崩光电探测器
%K 同轴封装
%K 频率响应
%K 跨阻放大器
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=47EA7CFDDEBB28E0&jid=9F6139E34DAA109F9C104697BF49FC39&aid=1D36885FD7A8294B303CFD49023E10D7&yid=99E9153A83D4CB11&vid=2001E0D53B7B80EC&iid=0B39A22176CE99FB&sid=C812B90E96151014&eid=B78CD622C1934236&journal_id=1004-4213&journal_name=光子学报&referenced_num=0&reference_num=12