%0 Journal Article
%T REQUIREMENT OF SILICON FLATNESS FOR SILICON DIRECT BONDING TECHNOLOGY<br>硅直接键合工艺对晶片平整度的要求
%A Fu Xinghua
%A Huang Qingan
%A Chen Junning
%A Tong Qinyi
%A <br>付兴华
%A 黄庆安
%A 陈军宁
%A 童勤义
%J 电子与信息学报
%D 1994
%I 
%X The influence of silicon slice flatness on bonding technology and the relation between foreign particle and resulting bubble are quantitatively presented by the elastic theory. It is demonstrated experimentally by X ray double crystal dif-fractometry and infrared transmission imager.
%K Bonding technology
%K Silicon material
%K Flatness
%K Double crystal dif- fractometry<br>键合工艺
%K 硅材料
%K 平整度
%K 双晶衍射技术
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=EFC0377B03BD8D0EF4BBB548AC5F739A&aid=8C42139AA5397457C4FFA63BED41843C&yid=3EBE383EEA0A6494&vid=7801E6FC5AE9020C&iid=38B194292C032A66&sid=211C7E02AC474301&eid=AF507FDD66D991DA&journal_id=1009-5896&journal_name=电子与信息学报&referenced_num=1&reference_num=11