%0 Journal Article
%T Internal stress and yield strength of copper films on substrates<br>附着铜膜的内应力及屈服强度
%A Zhang Jian-Min
%A Zhang Yan
%A Xu Ke-Wei
%A <br>张建民
%A 张研
%A 徐可为
%J 中国物理 B
%D 2005
%I 
%X Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.
%K copper film
%K internal stress
%K yield strength
%K X-ray diffraction
%K thermal-cycle substrate curvature<br>铜膜
%K 内应力
%K 屈服强度
%K X-射线衍射
%K 热循环基体弯曲
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=47EA7CFDDEBB28E0&jid=CD8D6A6897B9334F09D8D1648C376FB4&aid=3F4502484EAEF392D7AD4BA6650F1AE8&yid=2DD7160C83D0ACED&vid=F3583C8E78166B9E&iid=94C357A881DFC066&sid=6FEA2FD9BDAB9923&eid=BF1CF7F9466F9169&journal_id=1009-1963&journal_name=中国物理&referenced_num=0&reference_num=20