%0 Journal Article
%T Cu Diffusion in Co/Cu/TiN Films for Cu Metallization
%A Xiuhua CHEN
%A Xinghui WU
%A Jinzhong XIANG
%A Zhenlai ZHOU
%A Heyun ZHAO
%A Liqiang CHEN
%A <br>Xiuhua
%A CHEN
%A Xinghui
%A WU
%A Jinzhong
%A XIANG
%A Zhenlai
%A ZHOU
%A Heyun
%A ZHAO
%A Liqiang
%A CHEN
%J 材料科学技术学报
%D 2006
%I 
%X Some information on how to use in-situ determined diffusion coefficient of Cu to make barrier layer of Cu metallization in ultra large scale integrations (ULSIs) was provided. Diffusion coefficients of Cu in Co at low temperature were determined to analyze Cu migration to Co surface layer. The diffusion depths were analyzed using X-ray photoelectron spectroscopy (XPS) depth profile to investigate the diffusion effect of Cu in Co at different temperatures. The possible pretreatment temperature and time of barrier layer can be predicted according to the diffusion coefficients of Cu in Co.
%K Cu diffusion
%K Sputtering method
%K Co/Cu/TiN film
%K Metallization<br>钴/铜/氮化钛薄膜
%K 镀铜
%K 铜扩散
%K 喷涂法
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=132BB0B519AFE5400AB207D9CB4800D1&yid=37904DC365DD7266&vid=BC12EA701C895178&iid=38B194292C032A66&sid=556C1A86E372B606&eid=A04F01817ECB9A48&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=22