%0 Journal Article
%T Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder
%A Haitao MA
%A Haiping XIE
%A Lai WANG
%A <br>Haitao
%A MA
%A Haiping
%A XIE
%A Lai
%A WANG
%J 材料科学技术学报
%D 2007
%I 
%X The microstructure and melting behavior of Sn-9Zn-2Cu (SZC) lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interfacial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape (Cu, Ni)5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder. In addition, the interfacial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-lNi alloy.
%K Lead-free solder
%K Microstructure
%K Wetting property
%K Interfacial reaction
%K Intermetallic compounds<br>微量铋
%K 微量镍
%K 锡锌铜无铅焊料
%K 显微结构
%K 融化性能
%K 界面反应
%K 金属间化合物
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=99482B5805B128DA&yid=A732AF04DDA03BB3&vid=EA389574707BDED3&iid=CA4FD0336C81A37A&sid=35FC3610259C2B32&eid=656F8C8401D91023&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=21