%0 Journal Article
%T A Banding Structure in a Ni-Cu-Si Cast Alloy<br>
%A Qi ZHENG Yufeng ZHENG Hongyu ZHANG Xiaofeng SUN Hengrong GU AN Zhuangqi HU Institute of Metal Research
%A Chinese Academy of Sciences
%A Shenyang
%A China University of Science
%A Technology of China
%A Hefei
%A China
%A <br>
%J 材料科学技术学报
%D 2008
%I 
%X The solidified microstructure of a Ni-Cu-Si cast alloy has been investigated, and a kind of banding structure was observed. The results showed that, the banding structure was composed of coarser particles which were Ni3Si type of precipitates and similar to the fine particles precipitate uniformly distributed within matrix of Ni solid solution, in both crystal structure and composition. The formation of bandings was resulted from cast thermal stress and dislocation walls. It was found that the cracks propagated along these bandings in tensile test. The banding structure can be depressed by reducing the cast thermal stress, which can improve the Qtensile ductility.
%K Ni-Cu-Si cast alloy
%K Banding structure
%K Solidification
%K Thermal stress<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=E57923DC46603CA37BF95A300BDFC0E1&yid=67289AFF6305E306&vid=B91E8C6D6FE990DB&iid=94C357A881DFC066&sid=FCB110411B6339D8&eid=07C52AC66061533A&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=12