%0 Journal Article
%T High Strength Conductor by Directional Solidification
%A Hongquan WEN
%A Xiemin MAO
%A Kuangdi XU
%A <br>
%J 材料科学技术学报
%D 1998
%I 
%X The directional solidification of Cu-0.8 wt pct Cr alloy was investigated for high-strength conductors. An in-situ composite material in which the matrix is in cellular morphology and the well-distributed eutectics around the cells is formed in the directional solidification process. In such microstructure, the cellular matrix is as conductor and the coated-around eutectics as reinforcement. The formation mechanism of this microstructure is discussed from the interfacial instability. As a result, the tensile strength of the material along the solidification direction is two times more than that of the conventionally cast one, while the electrical conductivity is reduced a little by comparison with the pure Cu.
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=6351A24D49E786E8&yid=8CAA3A429E3EA654&vid=F3583C8E78166B9E&iid=CA4FD0336C81A37A&sid=CFAC5CB624A41AFD&eid=C753EB8AC8F551B9&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=0