%0 Journal Article
%T Simulative Design of Pad Structure for High Density Electronic Interconnection
%A Mingyu LI
%A Chunqing WANG
%A <br>Mingyu LI and Chunqing WANG State Key Lab. of Advanced Welding Production Technology
%A Harbin Institute of Technology
%A Harbin
%A China Shenzhen Graduate School of Harbin Institute of Technology
%A Shenzhen
%A ChinaAssoc. Prof.
%A Ph.D.
%J 材料科学技术学报
%D 2005
%I 
%X Solder bridge is a serious defect of solder joints in ultrafine pitch electronic device assemblies. Generation of the solder bridge is closely related to forming process of the solder joints. A three-dimensional model to simulate the formation of the solder bridge of QFP256 (quad flat packaging with 256 leads) is established and numerically calculated to predict the formation shape of the solder joints using surface evolver program. Based on the model, influence of structure of pads printed on circuit board on solder bridging is investigated. The results show that there is a critical solder volume Vc for solder joints to avoid solder bridging, and parameters of the pad size influence the critical solder volume.
%K Solder bridge
%K Fine pitch device
%K Simulation
%K Forming process<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=1D9B955CF1F08CA6&yid=2DD7160C83D0ACED&vid=659D3B06EBF534A7&iid=CA4FD0336C81A37A&sid=E84BBBDDD74F497C&eid=5D71B28100102720&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=16