%0 Journal Article
%T A New Model of Interfacial Physical Contact in Diffusion Bonding
%A Peng HE
%A Jicai FENG
%A Yiyu QIAN
%A <br>Peng HE
%A Jicai FENG and Yiyu QIAN National Key Laboratory of Advanced Welding Production Technology
%A Harbin Institute of Technology
%A Harbin
%A China
%J 材料科学技术学报
%D 2004
%I 
%X Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base material, the interface geometry character and brief mathematics process were put forth. Through analyzing contact process of diffusion bonding, contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.
%K Diffusion bonding
%K Physical contact
%K Interface layer<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=F6852C0FF26AAEED&yid=D0E58B75BFD8E51C&vid=A04140E723CB732E&iid=CA4FD0336C81A37A&sid=91C9056D8E8856E0&eid=4BB057F167CF3A60&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=5