%0 Journal Article
%T THE INTERFACIAL PREFERENTIAL DISSOLUTION ON SiC_p/Al COMPOSITES<br>SiCp／Al复合材料的界面优先溶解
%A YAO Hongyu
%A SONG Yujiu HUA Yingchun TU Mingjing
%A <br>姚红宇
%A 宋余九
%A 花迎春
%A 涂铭旌
%J 材料研究学报
%D 1994
%I 
%X ccording to the previous researches on corrosion of discontinuously reinforced Al alloy matrix composite, the role of reinforcement / matrix interface in corrosion is nothing but a preferable site for pitting initiation. The interfacial preferential dissolution (IPD) on SiCp/ Al composites as immersed in NaCl solution is reported in this article. IPD is not pitting at all for the operating mechanism is quite different from that for pitting, i.e. the occluded cell. IPD occurs on the composites with either pure Al or LY12 Al alloy matrix, no matter whether they are fabricated by cast or powder metallurgy process. Width of the plastically deformed zone around the interface, formed in quenching, resulting from the difference in coefficients of thermal expansion between reinforcement and matrix, is deduced to be 0.5D, where D is the diameter of SiC particulate. It is in coincidence with IPD's width, measured 0.3-0.4D. It is concluded that IPD is due to the poor integtity of the surface oxide film upon the plastic zone, independent the of chemical, metallurgical and galvanic-couple factors around the interface, if any. The copper-deposition test does indicate this poor integrity. The long term immersion test reveals that IPD causes intensified dissolution at SiC clusters and uniform dissolution for the composite with high SiC content. Moreover, IPD and pitting depress each other by cathodic protection. Most pits are located at the metallurgical imperfections.
%K metal matrix composite
%K corrosion
%K interface
%K residual stress<br>金属基
%K 复合材料
%K 界面
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=C101C4C04993B4D94FCD8446E6CBEB3B&aid=82FA0196E92019E828D0B5F84DF32ADE&yid=3EBE383EEA0A6494&vid=5D311CA918CA9A03&iid=94C357A881DFC066&sid=98494933359B55EC&eid=7D1E6EEC2019967D&journal_id=1005-3093&journal_name=材料研究学报&referenced_num=1&reference_num=4