%0 Journal Article
%T Basis Mechanism of MIC Poly-Si Thin Film Material Dynamic Gettered Technology and Its Applications<br>MIC薄膜多晶硅材料的动态镍吸除技术基本机理及其应用
%A Li Yang
%A Meng Zhiguo
%A Wu Chuny
%A Wong M
%A Kwok H S
%A Zhang Fang
%A Xiong Shaozhen
%A <br>李阳
%A 孟志国
%A 吴春亚
%A 王文
%A 郭海成
%A 张芳
%A 熊绍珍
%J 半导体学报
%D 2007
%I 
%X The basis mechanism and main process flow of metal induced crystallization poly-Si (MIC poly-Si) dynamic gettering are discussed,and its applications are studied for use in poly-Si thin film transistor devices.In the research of MIC poly-Si and producing TFT with poly-Si as the active layer,we find that nickel residue is left in the MIC poly-Si thin film,and the amount of nickel is extremely high along the grain boundary.This can reduce the stability and reliability of the TFT as well as the whole system.In order to improve the performance of MIC thin films and devices,we use dynamic nickel gettering by phosphor-silicate glass (PSG) to absorb nickel effectively,reducing the residual nickel in the poly-Si,reducing the number of defects at the conflicting crystal boundaries,and decreasing the leakage current of the TFT.The simple process flow and low cost make it suitable for industrial manufacturing.This is a necessary step in the production of microelectronics devices and systems.
%K MIC poly-Si
%K PSG
%K dynamic Ni gettering
%K solid solubility<br>金属诱导晶化多晶硅
%K 磷硅玻璃
%K 动态镍吸除
%K 固溶度
%K 多晶硅薄膜
%K 硅材料
%K 动态
%K 吸除
%K 机理
%K 应用
%K Applications
%K Technology
%K Dynamic
%K Thin
%K Film
%K Material
%K Mechanism
%K 工艺技术
%K 电路系统
%K 微电子器件
%K 高稳定性
%K 工业化生产
%K 大批量
%K 处理成本
%K 漏电流
%K 缺陷密度
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=5646F94D35B54F6FEBD4FCEBAC24339E&yid=A732AF04DDA03BB3&vid=D3E34374A0D77D7F&iid=F3090AE9B60B7ED1&sid=3ACD4359575EFDCA&eid=14287D13823C7461&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=18