%0 Journal Article
%T Thermal Fatigue Life Time Prediction of Sn-3.5Ag Lead-Free SolderJoint for Chip Scale Package<br>CSP封装Sn-3.5Ag焊点的热疲劳寿命预测
%A Han Xiao
%A Ding Han
%A Sheng Xinjun
%A Zhang Bo
%A <br>韩 潇
%A 丁汉
%A 盛鑫军
%A 张波
%J 半导体学报
%D 2006
%I 
%X The thermal fatigue life time of Sn-3.5Ag lead-free solder joint of a chip scale package subjected to a thermal cycling load is predicted.Using the finite element analysis software ANSYS,a three dimensional symmetric model of the chip scale package is established,which uses the Anand constitutive model to describe the viscoplastic material property of Sn-3.5Ag lead-free solder joints.The deformation of the CSP package and the stress-strain variation of the solder joint under a thermal cycling load are investigated through thermal stress analysis.The Darveaux fatigue life prediction method is used to calculate the fatigue life time of the lead-free solder joint based on the finite element simulation results.
%K chip scale package
%K lead-free solder joint
%K Anand constitutive model
%K fatigue life
%K finite element analysis<br>芯片尺寸封装
%K 无铅焊点
%K Anand本构模型
%K 疲劳寿命
%K 有限元分析
%K 封装结构
%K 焊点
%K 疲劳寿命预测
%K Time
%K Prediction
%K Fatigue
%K Life
%K Thermal
%K Package
%K Scale
%K Chip
%K 寿命模型
%K 结合
%K 应变行为
%K 应力
%K 变形
%K 热循环载荷
%K 分析
%K 方法
%K 有限元模拟
%K 材料特性
%K 粘塑性
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=2D2A4987AFBC1D68&yid=37904DC365DD7266&vid=DB817633AA4F79B9&iid=9CF7A0430CBB2DFD&sid=4B35F43975EC564A&eid=19519743553AEE80&journal_id=1674-4926&journal_name=半导体学报&referenced_num=3&reference_num=9