%0 Journal Article
%T Texture Analysis of Damascene Copper Interconnects<br>大马士革铜互连线织构的研究
%A Wang Xiaodong
%A Ji Yuan
%A Zhong Taoxing
%A Li Zhiguo
%A Xia Yang
%A Liu Danmin
%A Xiao Weiqiang
%A <br>王晓冬
%A 吉元
%A 钟涛兴
%A 李志国
%A 夏洋
%A 刘丹敏
%A 肖卫强
%J 半导体学报
%D 2008
%I 
%X Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD.All specimens appear mixed texture and(111)texture is the dominate component.As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found.Lower aspect ratio of lines and anneal treatment procured larger grains and stronger(111)texture.Meanwhile,the intensity proportion of other textures with...
%K Cu interconnects
%K texture
%K misorientation
%K coincident site lattice boundaries
%K EBSD<br>Cu互连线
%K 织构
%K 错配角
%K 重合点阵晶界
%K 电子背散射衍射
%K Cu
%K interconnects
%K texture
%K misorientation
%K coincident
%K site
%K lattice
%K boundaries
%K EBSD
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=73247A4337DBD6DE578AE672D8AB3905&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=B31275AF3241DB2D&sid=BE14F47B38DC36BB&eid=D932AD0F8FDA3032&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=15