%0 Journal Article
%T Structure for Electrical Measurement of the Thermal Expansion Coefficient of Polysilicon Thin Films<br>多晶硅薄膜热膨胀系数的电测试结构
%A Hu Dongmei
%A Huang Qing''an
%A Li Weihua
%A <br>胡冬梅
%A 黄庆安
%A 李伟华
%J 半导体学报
%D 2008
%I 
%X A novel method for electrically measuring the thermal expansion coefficient of polysilicon thin films is presented.A thermal-electro-mechanical compliant model of the polysilicon thin film is established.Finite element software Coventor and ANSYS are used to verify this method.This method is convenient,and its output is in the form of an electrical signal.Thus,it is valuable for in-situ measuring the thermal expansion coefficient of polysilicon thin films
%K thermal expansion coefficient
%K polysilicon thin films
%K electrical measurement
%K pull-in<br>热膨胀系数
%K 多晶硅薄膜
%K 电测试
%K 吸合
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=5E70BC080C82FFBCFF7D560680BBBF67&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=F3090AE9B60B7ED1&sid=EA357AD73C8E13BC&eid=885CEFEC57DA488F&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=13