%0 Journal Article
%T Dummy fill effect on CMP planarity<br>冗余金属填充对化学机械抛光的平坦性影响研究
%A Zhou Junxiong
%A Chen Lan
%A Ruan Wenbiao
%A Li Zhigang
%A Shen Weixiang
%A Ye Tianchun
%A <br>周隽雄
%A 陈岚
%A 阮文彪
%A 李志刚
%A 沈伟翔
%A 叶甜春
%J 半导体学报
%D 2010
%I 
%X With the use of a chemical-mechanical polishing (CMP) simulator verified by testing data from a foundry, the effect of dummy fill characteristics, such as fill size, fill density and fill shape, on CMP planarity is analyzed. The results indicate that dummy density has a significant impact on oxide erosion, and copper dishing is in proportion to dummy size. We also demonstrate that cross shape dummy fill can have the best dishing performance at the same density.
%K chemical mechanical polishing
%K dummy fill
%K dishing
%K erosion
%K planarity<br>化学机械抛光，冗余填充，凹陷，侵蚀，平坦性
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=78FDDA95F6F8F9A1A1E57F5167FE3DD1&yid=140ECF96957D60B2&vid=4AD960B5AD2D111A&iid=F3090AE9B60B7ED1&sid=34623B3AF37C96AC&eid=E158A972A605785F&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=0