%0 Journal Article
%T Intermediate Layer Bonding for Silicon and Glass Based on UV Adhesive<br>硅/玻璃紫外固化中间层键合
%A Cheng Wenjin
%A Tang Zirong
%A Liao Guanglan
%A Shi Tielin
%A Lin Xiaohui
%A Peng Ping
%A <br>程文进
%A 汤自荣
%A 廖广兰
%A 史铁林
%A 林晓辉
%A 彭平
%J 半导体学报
%D 2008
%I 
%X Taking advantage of the transparency of glass and the maturity of UV curing technology,an intermediate layer bonding process with ultraviolet curable adhesive was investigated to bond silicon wafer to glass substrate.Following the spin-coating of UV-curable adhesive onto the wafer,the silicon wafer and glass substrate were bonded under UV light with a wavelength of 365nm.Experimental results demonstrate that the UV curing approach can be applied in the silicon-glass intermediate layer bonding.The bonding st...
%K room-temperature bonding
%K intermediate layer
%K UV curing<br>室温键合
%K 中间层
%K 紫外固化
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=120F546B6A0F101CEDCAEE34EBF91B8D&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=CA4FD0336C81A37A&sid=E114CF9BB47B65BE&eid=B1F98368A47B8888&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=11