%0 Journal Article
%T Finite Element Simulation and Process Optimization of Localized Laser Bonding<br>激光键合的有限元仿真及工艺参数优化
%A Ma Ziwen
%A Tang Zirong
%A Liao Guanglan
%A Shi Tielin
%A Nie Lei
%A Zhou Ping
%A <br>马子文
%A 汤自荣
%A 廖广兰
%A 史铁林
%A 聂磊
%A 周平
%J 半导体学报
%D 2007
%I 
%X The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.In the model,the temperature distribution with different process parameters is simulated and the bondline width is obtained.Then the key process parameters of laser bonding,including laser power,scanning velocity,and initial temperature,are obtained with the help of scanning experiments.Finally,with regression analysis on the simulation results,a regression model is made and the optimal process parameters of laser bonding are found.This can provide a theoretical basis for further study on laser bonding.
%K laser bonding
%K finite element method
%K regression analysis
%K bondline width<br>激光键合
%K 有限元法
%K 回归分析
%K 键合线宽
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=F0FAE596B72D32A2&yid=A732AF04DDA03BB3&vid=D3E34374A0D77D7F&iid=B31275AF3241DB2D&sid=342E193BAB6B28C5&eid=E5E53C81AEB35E6C&journal_id=1674-4926&journal_name=半导体学报&referenced_num=1&reference_num=18