%0 Journal Article
%T Effects of pattern characteristics on the copper electroplating process<br>版图图形特征对铜电镀工艺的影响
%A Ruan Wenbiao
%A Chen Lan
%A Li Zhigang
%A Ye Tianchun
%A Ma Tianyu
%A Wang Qiang
%A <br>阮文彪
%A 陈岚
%A 李志刚
%A 叶甜春
%A 马天宇
%A 王强
%J 半导体学报
%D 2011
%I 
%X The non-planarity of a surface post electroplating process is usually dependent on variations of key layout characteristics including line width, line spacing and metal density. A test chip is designed and manufactured in a semiconductor foundry to test the layout dependency of the electroplating process. By checking test data such as field height, array height, step height and SEM photos, some conclusions are made. Line width is a critical factor of topographical shapes such as the step height and height difference. After the electroplating process, the fine line has a thicker copper thickness, while the wide line has the greatest step height. Three typical topographies, conformal-fill, supper-fill and over-fill, are observed. Moreover, quantified effects are found using the test data and explained by theory, which can be used to develop electroplating process modeling and design for manufacturability (DFM) research.
%K ULSI
%K electroplating
%K CEAC
%K pattern dependency
%K systematic variations
%K DFM<br>超大规模集成电路，电镀，曲率增强加速剂覆盖率，图形效应，系统偏差，可制造性设计
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=786307CB160BCFD2A069963CCE967C1C&yid=9377ED8094509821&vid=9971A5E270697F23&iid=94C357A881DFC066&sid=9DB91ECE554C1CEE&eid=E158A972A605785F&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=0