%0 Journal Article
%T Underfill Delarnination and Solder Joint Failure of Flip Chip on Board<br>倒扣芯片连接底充胶分层和焊点失效
%A XU Bu lu
%A ZHANG Qun
%A CAI Xia
%A HUANG Wei dong
%A XIE Xiao ming
%A CHENG Zhao nian
%A <br>徐步陆
%A 张群
%A 彩霞
%A 黄卫东
%A 谢晓明
%A 程兆年
%J 半导体学报
%D 2001
%I 
%X The delamination propagation behavior at the interface between the chip and the underfill is investigated and the crack propagation rates are measured via C SAM inspection for two types (B & D) of flip chip packages under thermal cycle loading.Meanwhile,in the related simulations of the element,the strain energy releasing rates near the crack tip under different conditions can be calculated by employing the fracture mechanical method.Then,the Paris half empirical equation,used as design criteria of flip chip package reliability,is determined with the crack propagation rates and the energy release rates obtained.
%K flip chip technology
%K underfill
%K finite element
%K energy release rate
%K delamination and crade propagation<br>倒扣芯片技术
%K 底充胶
%K 有限元模拟
%K 能量释放率
%K 界面分层与裂缝扩展
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=EE341CE8AE9CB41F&yid=14E7EF987E4155E6&vid=BC12EA701C895178&iid=F3090AE9B60B7ED1&sid=65C780F1B91D7CD5&eid=E3C11E2483CABC48&journal_id=1674-4926&journal_name=半导体学报&referenced_num=2&reference_num=19