%0 Journal Article
%T Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam<br>热致封装效应对MEMS固支梁谐振频率的影响
%A Li Ming
%A Song Jing
%A Huang Qing''''an
%A Tang Jieying
%A <br>李明
%A 宋竞
%A 黄庆安
%A 唐洁影
%J 半导体学报
%D 2008
%I 
%X To characterize the effect of deformation of die-bonding packages on the performance of MEMS devices,a laser scanning vibrometer was used,based on the theory of vibration analysis and signal processing.Because it is a commonly used structure in MEMS design,a surface micromachined polysilicon fixed-fixed beam was chosen.Its resonant frequencies from the 1st to the 3rd order were recorded before and after die bonding and compared to FEM simulations.The results suggest that the thermo-mechanical coupling deformation in the multilayer packaging structure affects the performance of MEMS device remarkably,and the resonant frequencies shift of the beam are more than 15%~30%.Therefore,it is possible to include the package effect in the primary design circle of MEMS devices,which may enhance the device performance and shorten the primary design cycle.
%K MEMS
%K packaging effect
%K fixed-fixed beam
%K resonant frequency
%K co-design<br>MEMS
%K 封装效应
%K 固支梁
%K 谐振频率
%K 协同设计
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=02C73D6DA98689FE4193C311EF0DE740&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=CA4FD0336C81A37A&sid=0B4F496D54044D86&eid=F1177A9DF1349B63&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=7