%0 Journal Article
%T Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation<br>单晶硅纳米级磨削过程中磨粒磨损的分子动力学仿真
%A Guo Xiaoguang
%A Guo Dongming
%A Kang Renke
%A Jin Zhuji
%A <br>郭晓光
%A 郭东明
%A 康仁科
%A 金洙吉
%J 半导体学报
%D 2008
%I 
%X This paper first establishes a 3D molecular dynamics simulation model for abrasive wear.The Einstein model in solid-state physics is introduced for the conversion between the kinetic energy and temperature of the diamond atom.Then,a 3D MD program is made and executed.The results that the abrasion occurs in the early of period of the grinding.With the advance of the grinding,this kind of wear is no longer seen and the grinding comes into a steady state.In addition,the abrasive wear only can be found in the bottom of the abrasive and the surface effect has a close relation with the abrasion.The surface effect causes the shortage of configuration of atoms in the bottom of the abrasive.Thus,there are defects on the surface of the abrasive,especially at the bottom of the abrasive where the atoms have strong activity and are in an unstable condition.According to the least-energy principle,these atoms will release the energy spontaneously through plastic deformation and amorphous phase transformation,producing the wear.
%K nanometric machining
%K molecular dynamics simulation
%K abrasive wear<br>纳米级加工
%K 分子动力学仿真
%K 磨粒磨损
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=10E1A9C4B05150ED93CB4C41EA1DC7BE&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=B31275AF3241DB2D&sid=334C32317477C964&eid=05FAA4D00F9315BD&journal_id=1674-4926&journal_name=半导体学报&referenced_num=2&reference_num=7