%0 Journal Article
%T Thermal Analysis of Silicon Micromachining Based Micro Hotplates<br>基于硅微加工工艺的微热板传热分析
%A 余隽
%A 唐祯安
%A 陈正豪
%A 魏广芬
%A 王立鼎
%A 闫桂贞
%J 半导体学报
%D 2005
%I 
%X Thermal simulation of three types of MHPs (surface micro-machined,back-side bulk silicon micro-machined,and front-side bulk silicon micro-machined) working in atmosphere and vacuum is performed with 3D FEA.Their first two types of MHPs are fabricated and their experimental results are in agreement with the FEA.It is shown that,power consumption of the surface micromachined MHP is smaller than the back-side bulk silicon micromachined MHP in vacuum;however,in atmosphere,thermal conduction of the thin air layer in the surface micro-machined MHP dramatically increases its power consumption,with is much larger than that of the back-side bulk silicon micromachined MHP.
%K micro hotplate
%K silicon micromachining
%K finite element analysis
%K heat conduction<br>微热板
%K 硅微加工工艺
%K 有限元
%K 热传导
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=6D93A4773FBD39B8&yid=2DD7160C83D0ACED&vid=96C778EE049EE47D&iid=CA4FD0336C81A37A&sid=C29816B2656377A7&eid=E0F6F365E4766526&journal_id=1674-4926&journal_name=半导体学报&referenced_num=5&reference_num=11