%0 Journal Article
%T Model-Based Dynamic Dissection in OPC<br>基于光刻模型的动态自适应切分OPC
%A Yang Yiwei
%A Shi Zheng
%A Yan Xiaolang
%A <br>杨祎巍
%A 史峥
%A 严晓浪
%J 半导体学报
%D 2008
%I 
%X optical proximity correction (OPC) is a key step in nanometer scale lithography technology.Currently,dissection in OPC is recipe-based.However,as the critical features shrink and the layout becomes more complicated,it is hard to debug and handle all possible cases in the layout;Incomplete recipe-based dissection will introduce or worsen the effects of ripple,breaking,bridging,and line-end shortening.This paper presents a new dissection method,which is lithographic model-based and can dynamically change the dissection and sampling point positions during OPC correction loops.According to experiments on 90nm designs,the new dissection method can reduce 10%~15% of segments,save considerable time during recipe debugging,improve OPC quality,and reduce hot spot errors rates by 35%.
%K OPC
%K DFM
%K Dissection
%K lithography modeling<br>光学邻近校正
%K 可制造型设计
%K 动态切分
%K 光刻模型
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=B9D602CF463B8B6FFF72CBE1668D5D4F&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=DF92D298D3FF1E6E&sid=E64BF5BE957AB7AB&eid=83F3E1555B654B95&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=8