%0 Journal Article %T Study on Short-channel Thin Film CMOS/SIMOX
短沟道薄硅膜CMOS/SIMOX电路的研究 %A Chen Nanxiang/Inst of Low Energy Nuclear Physics %A Beijing Normal %A UnivShi Yongquan/Shaanxi Micro Electronics InstituteWang Zhonglie/Inst of Low Energy Nuclear Physics %A Beijing Normal %A UnivHuang Chang/Inst of Low Energy Nuclear Physics %A Beijing Normal %A Univ %A
陈南翔 %A 石涌泉 %A 王忠烈 %A 黄敞 %J 半导体学报 %D 1990 %I %X 通过大剂量氧离子注入(150key,2×10~(18)O~+/cm~2)及高温退火(1100℃,8h)便可形成质量较好的SIMOX结构。本文报道了制备在硅膜厚度为160nm的SIMOX结构上的短沟道CMOS/SIMOX电路特性。实验结果表明:薄硅膜器件有抑制短沟道效应(如阈值电压下降)、改善电路的速度性能等优点,因而薄硅膜SIMOX技术更适合亚微米CMOS IC的发展。 %K Thin film si %K characteristics of sub-threshold %K short-channel effect %K SIMOX
薄硅源 %K 沟道效应 %K CMOS/Simox %K 电路 %U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=F0493C5F10F95157&yid=8D39DA2CB9F38FD0&vid=708DD6B15D2464E8&iid=E158A972A605785F&sid=407C905D8F0449C4&eid=85002451B65CE0D1&journal_id=1674-4926&journal_name=半导体学报&referenced_num=3&reference_num=3