%0 Journal Article
%T Investigation of Adhesive Fillet Height in SCSP by Finite Element Methods<br>有限元方法对SCSP粘结剂溢出问题的研究
%A Jin Wei
%A Sang Wenbin
%A Zhang Qi
%A Teng Jianyong
%A <br>金玮
%A 桑文斌
%A 张奇
%A 滕建勇
%J 半导体学报
%D 2004
%I 
%X Finite element methods is used to analyze the adhesive fillet height in SCSP.The finite element simulation is performed according to different adhesive fillet height.The simulation results are in accordances with the experiment results.In order to reduce the delamination caused by thermal stress during assembly,the optimal adhesive fillet height range is obtained by finite element simulation.
%K SCSP
%K fillet height
%K delamination
%K finite element methods (FEM)<br>SCSP
%K 溢出高度
%K 分层
%K 有限元方法
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=BBD5EA3DD1C87C2C&yid=D0E58B75BFD8E51C&vid=C5154311167311FE&iid=0B39A22176CE99FB&sid=E1D946F217E3B046&eid=FBCA02DBD05BD4EA&journal_id=1674-4926&journal_name=半导体学报&referenced_num=4&reference_num=12