%0 Journal Article
%T A Precise Model for Simulation of Temperature Distribution in Power Modules<br>一种用于功率模块热分布特性研究的精确模型(英文)
%A GENG Li
%A CHEN Zhi-ming
%A RKruemmer
%A TReimann
%A JPetzoldt
%A <br>耿莉
%A 陈治明
%A R Kruemmer
%A T Reimann
%A J Petzoldt
%J 半导体学报
%D 2001
%I 
%X The interaction between the active chips mounted and the same base plate is considered as a thermoelectrical coupling effect.An approach to coupling effect analysis of a multi-chip system is presented with IGBT as a sample.Finite element method is used to evaluate the temperature distribution in power modules.The precise electrothermal model is obtained by fitting the curve of transient thermal impedance with a finite series of exponential terms,in which,the thermal-coupling effect among chips is considered as a prediction of the highest transient temperature of the chips.This model can be used in many thermal monitoring systems.Both ANSYS and PSPICE si- mulation software have been employed,and the simulation results agree with the experimental ones very well.
%K power electronics
%K IGBT module
%K thermal simulation
%K thermal coupling<br>功率电子
%K IGBT模块
%K 热仿真
%K 热耦合
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=1B74BA3D1836D67D&yid=14E7EF987E4155E6&vid=BC12EA701C895178&iid=94C357A881DFC066&sid=E5D85F291CED2DA6&eid=4AB4178709047BE3&journal_id=1674-4926&journal_name=半导体学报&referenced_num=4&reference_num=3