%0 Journal Article
%T Performance of Al/AlN Substrate<br>铝/氮化铝电子陶瓷基板的制备及性能的研究
%A PENG Rong
%A ZHOU He-Ping
%A NING Xiao-Shan
%A LIN Yuan-Bo
%A Xu Wei
%A <br>彭榕
%A 周和平
%A 宁晓山
%A 林渊博
%A 徐伟
%J 无机材料学报
%D 2002
%I Science Press
%X In this work, by die-casting-bonding process, in 948-1098K and N2 atmosphere, Al/AlN substrate was produced successfully. The bonding strength of Al and AlN substrate tested by mechanic testing equipment was more than 15.56MPa; The micorstructure of Al/AlN interface was investigated by SEM and microscope. The results show that there is nothing produced in the interface of Al/AlN, the crystal of aluminium grows on the surface of AlN directly, the bonding temperatures have no influence on Al/AlN interface strength.
%K bonding
%K Al
%K die-casting-bonding
%K AlN substrates<br>铝／氮化铝电子陶瓷基板
%K 制备
%K 性能
%K 敷接
%K 结合强度
%K 电子元器件
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=ABC0063016AF57E1C73EF43C8D2212BD&aid=CF1D44066729B9B2&yid=C3ACC247184A22C1&vid=BCA2697F357F2001&iid=B31275AF3241DB2D&sid=9E33BE6F309BC209&eid=83B38B9EF611BE13&journal_id=1000-324X&journal_name=无机材料学报&referenced_num=2&reference_num=7