%0 Journal Article
%T Diamond Films Deposited on Copper Substrate with a Nickel Intermediate Layer<br>铜上采用镍过渡层化学气相沉积金刚石薄膜的研究
%A MA Zhi-bin
%A WU Qin-Chong
%A WANG Jian-Hua
%A WANG Chuan-Xin
%A LI Xiang-feng
%A <br>马志斌
%A 邬钦崇
%A 汪建华
%A 王传新
%A 黎向锋
%J 无机材料学报
%D 2000
%I Science Press
%X The chemical vapor deposition of diamond films on copper substrate with Ni intermediate layer was studied. The adhesion of the diamond film on the copper substrate was improved due to the formation of a Cu-Ni eutectic between the copper and the Ni interlayer. Scanning electron microscopy and Raman spectroscopy were used to investigate the films: The diamond films with (100) oriented diamond particles were obtained under suitable conditions, which involved scratching carefully the substrate with diamond grits and subsequently annealing the substrate with high temperature hydrogen plasma. The uniformity of the Cu-Ni-C-H eutectic influenced the uniformity of the diamond film.
%K diamond film
%K chemical vapor deposition
%K intermediate layer<br>金刚石薄膜
%K 化学气相沉积
%K 镍过渡层
%K 铜
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=ABC0063016AF57E1C73EF43C8D2212BD&aid=9BBEB41E82C566CE&yid=9806D0D4EAA9BED3&vid=23CCDDCD68FFCC2F&iid=94C357A881DFC066&sid=E4D705EE6D9DC112&eid=7C8C2BAFC9BA0571&journal_id=1000-324X&journal_name=无机材料学报&referenced_num=7&reference_num=5