%0 Journal Article
%T Research of the Performance of A1/Al2O3 Substrate
Al/Al2O3陶瓷接合基板的制备及性能研究
%A PENG Rong
%A ZHOU He-Ping
%A NING Xiao-Shan
%A XU Wei
%A LIN Yuan-Bo
%A
彭榕
%A 周和平
%A 宁晓山
%A 徐伟
%A 林渊博
%J 无机材料学报
%D 2002
%I Science Press
%X After getting rid of Al2O3 film from the surface of melting Al, Al can wet and bond Al2O3 substrate perfectly. In this work, by die-casting-bonding process, in the temperautre range of 948-1098K and under N2 atmosphere, Al/Al2O3 substrates were produced successfully. The performance of Al/Al2O3 substrates was investigated by SEM and mechanic testing equipment. The bonding strength of Al/Al2O3 measured is more than 15.94MPa.
%K bonding
%K Al
%K die-casting-bonding Al2O3 substrates
Al/Al2O3电子陶瓷基板
%K 制备
%K 性能
%K 敷接
%K 剥离强度
%K 氧化铝
%K 铝
%K 结构
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=ABC0063016AF57E1C73EF43C8D2212BD&aid=A71FC5F04E56E1A1&yid=C3ACC247184A22C1&vid=BCA2697F357F2001&iid=E158A972A605785F&sid=507521DBC725630F&eid=FA98B938D085B826&journal_id=1000-324X&journal_name=无机材料学报&referenced_num=2&reference_num=6