%0 Journal Article %T Research of the Performance of A1/Al2O3 Substrate
Al/Al2O3陶瓷接合基板的制备及性能研究 %A PENG Rong %A ZHOU He-Ping %A NING Xiao-Shan %A XU Wei %A LIN Yuan-Bo %A
彭榕 %A 周和平 %A 宁晓山 %A 徐伟 %A 林渊博 %J 无机材料学报 %D 2002 %I Science Press %X After getting rid of Al2O3 film from the surface of melting Al, Al can wet and bond Al2O3 substrate perfectly. In this work, by die-casting-bonding process, in the temperautre range of 948-1098K and under N2 atmosphere, Al/Al2O3 substrates were produced successfully. The performance of Al/Al2O3 substrates was investigated by SEM and mechanic testing equipment. The bonding strength of Al/Al2O3 measured is more than 15.94MPa. %K bonding %K Al %K die-casting-bonding Al2O3 substrates
Al/Al2O3电子陶瓷基板 %K 制备 %K 性能 %K 敷接 %K 剥离强度 %K 氧化铝 %K 铝 %K 结构 %U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=ABC0063016AF57E1C73EF43C8D2212BD&aid=A71FC5F04E56E1A1&yid=C3ACC247184A22C1&vid=BCA2697F357F2001&iid=E158A972A605785F&sid=507521DBC725630F&eid=FA98B938D085B826&journal_id=1000-324X&journal_name=无机材料学报&referenced_num=2&reference_num=6