%0 Journal Article
%T An analytical thermal model for 3D integrated circuit considering through silicon via<br>考虑硅通孔的三维集成电路热传输解析模型
%A Zhu Zhang-Ming
%A Zuo Ping
%A Yang Yin-Tang
%A <br>朱樟明
%A 左平
%A 杨银堂
%J 物理学报
%D 2011
%I 
%X Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via (TSV),the equivalent thermal model for TSV is presented in this paper.And then,the corresponding analytical thermal model with considering TSV is deriveed.Finally,Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration.The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits,and the increase of...
%K laser-driven flyer
%K laser irradiation
%K optical fiber array probe
%K laser plasma<br>三维集成电路
%K 热管理
%K 硅通孔
%K 等效热模型
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=47EA7CFDDEBB28E0&jid=29DF2CB55EF687E7EFA80DFD4B978260&aid=7FB288757ED284A02F43F65C6D613E09&yid=9377ED8094509821&vid=BFE7933E5EEA150D&iid=708DD6B15D2464E8&sid=FCE5064F75C2C99A&eid=2B25C5E62F83A049&journal_id=1000-3290&journal_name=物理学报&referenced_num=0&reference_num=14