%0 Journal Article
%T Elimination of Glue Binding Stress in Composed Photoelastic Model<br>复合弹模光弹模型中粘结约束应力的消除方法
%A Tan Xueshu
%A <br>谭学术
%J 实验力学
%D 1988
%I 
%X Tee glue binding stress in 3-D photoelastic model stuck together from materials of different modulus of elasticity is analysed and discussed. Two methods for eliminating the binding stress are presented.
%K different modulus
%K photoelastic model<br>变弹性模量
%K 光弹模型
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=49067A0A0D864088C06A84AACB51A5B2&aid=D1FA3C1735E160F6F9AF94756C4F933E&yid=0702FE8EC3581E51&vid=38B194292C032A66&iid=E158A972A605785F&journal_id=1001-4888&journal_name=实验力学&referenced_num=0&reference_num=0