%0 Journal Article
%T 利用具有相位跳跃技术的阴影摩尔图测量电子组装元件的热翘曲
%A Yinyan
%A Wang
%J 实验力学
%D 2011
%I 
%K shadow
%K moiré
%K printed
%K circuit
%K board
%K warpage
%K electronic
%K packages
%K fringe
%K pattern
%K analysis
%K phase
%K stepping
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=49067A0A0D864088C06A84AACB51A5B2&aid=EB1EEE94DAF205C68F0812492F85B42F&yid=9377ED8094509821&vid=96C778EE049EE47D&iid=DF92D298D3FF1E6E&sid=EED44B83FAB71309&eid=547991B346A6585E&journal_id=1001-4888&journal_name=实验力学&referenced_num=0&reference_num=0