%0 Journal Article
%T Model analysis and experimental investigation of the friction torque during the CMP process<br>化学机械抛光过程中扭矩的模型分析与试验研究
%A Guo Dongming
%A Xu Chi
%A Kang Renke
%A Jin Zhuji
%A <br>郭东明
%A 徐驰
%A 康仁科
%A 金洙吉
%J 半导体学报
%D 2011
%I 
%X A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.
%K CMP
%K friction torque
%K endpoint detection<br>化学机械抛光
%K 扭矩
%K 摩擦力
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=786307CB160BCFD2D91FC0511A783FA3&yid=9377ED8094509821&vid=9971A5E270697F23&iid=38B194292C032A66&sid=83F546FD04A993A9&eid=94C357A881DFC066&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=0