%0 Journal Article
%T A cross-coupled-structure-based temperature sensor with reduced process variation sensitivity<br>基于交叉耦合结构的抗工艺偏差温度传感器
%A Tie Meng
%A Cheng Xu
%A <br>帖猛
%A 程旭
%J 半导体学报
%D 2009
%I 
%X An innovative, thermally-insensitive phenomenon of cascaded cross-coupled structures is found. And a novel CMOS temperature sensor based on a cross-coupled structure is proposed. This sensor consists of two differ- ent ring oscillators. The first ring oscillator generates pulses that have a period, changing linearly with temperature. Instead of using the system clock like in traditional sensors, the second oscillator utilizes a cascaded cross-coupled structure to generate temperature independent pulses to c...
%K CMOS
%K cross-coupled
%K delay
%K ring oscillator
%K temperature sensor
%K thermal insensitivity<br>CMOS
%K 交叉耦合
%K 延迟
%K 环形振荡器
%K 温度传感器
%K 温度不相关
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=38514C448A1FBC9A5C0C8A9FC8806615&yid=DE12191FBD62783C&vid=340AC2BF8E7AB4FD&iid=E158A972A605785F&sid=8FD5CBA19638ED19&eid=DF92D298D3FF1E6E&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=0