%0 Journal Article
%T Gold thick film conductors
%A M. V. Coleman
%A G. E. Gurnett
%J Gold Bulletin
%@ 2190-7579
%D 1977
%I Springer
%R 10.1007/BF03215436
%X Conventional thick film conductors rely for their adhesion on the formation of a glassy layer which keys them both chemically and mechanically to the substrate surface. A newer type of conductor contains no glass frit but is reactively-bonded to the substrate, resulting in different properties which may be advantageous for certain applications. This article is based upon a contribution presented to the International Hybrid Microelectronics Society¡¯s European Conference held at Bad Homburg, West Germany, in May.
%U http://link.springer.com/article/10.1007/BF03215436