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SiC陶瓷/金属钨的SPS扩散焊接
Diffusion Welding SiC Ceramic/Tungsten by SPS

DOI: 10.12677/MS.2013.31002, PP. 7-10

Keywords: 放电等离子烧结;SiC陶瓷;钨;扩散焊接
Spark Plasma Sintering
, SiC Ceramic, Tungsten, Diffusion Welding Technology

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Abstract:

本文采用放电等离子烧结(SPS)技术,对用于高温环境下服役的SiC陶瓷扩散焊接进行了探索研究。结果表明,采用SPS技术可以在1300~1500实现SiC/W的连接。在SPS扩散焊接条件下SiCW在界面处会发生化学反应,形成一个主要组分为WCSi3W5等新相的过渡层,且随着焊接时间延长和温度升高,W持续向SiC层扩散在过渡层和SiC的界面上形成新的反应物,从而导致过渡层的厚度增加。过渡层的厚度对焊接件性能的影响呈现非线性变化,对焊接件的三点弯曲强度测试表明:在1410时,保温5 min,材料在界面处的弯曲强度达到最高,约162 MPa。对焊接后金属钨的结构分析显示,高温过程对钨的微结构没有明显的改变,断裂方式仍为延性断裂。显然,SPS可以成为一种快速、有效的SiC陶瓷/金属W扩散焊接
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